Invention Grant
- Patent Title: Printhead integrated circuit comprising thermal bend actuator
- Patent Title (中): 打印头集成电路包括热弯曲致动器
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Application No.: US11165302Application Date: 2005-06-24
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Publication No.: US07159968B2Publication Date: 2007-01-09
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain
- Priority: AUPP6539 19981016
- Main IPC: B41J2/04
- IPC: B41J2/04

Abstract:
A printhead integrated circuit comprising a drive circuitry and a plurality of nozzles is provided. Each nozzle comprises a chamber for holding ink to be ejected, the chamber having an opening defined in a roof structure; and a thermal bend actuator for ejecting droplets of ink from the chamber through the opening. The bend actuator is configured as a cantilever with one end of the cantilever anchored to a base and the opposite end supporting a paddle. The actuator has a deflector section constructed of a material having a high coefficient of thermal expansion and a barrier layer constructed of a dielectric material having low thermal conductivity. A supply of current from the drive circuitry to the deflector section causes differential thermal expansion between the deflector section and the barrier layer, such that the actuator bends and the paddle ejects a droplet of ink from the nozzle.
Public/Granted literature
- US20050243134A1 Printhead integrated circuit comprising thermal bend actuator Public/Granted day:2005-11-03
Information query
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