Invention Grant
- Patent Title: Motherboard having selective audio connection jack layout
- Patent Title (中): 主板具有选择性音频连接插孔布局
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Application No.: US11142074Application Date: 2005-06-01
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Publication No.: US07160114B2Publication Date: 2007-01-09
- Inventor: Jin-Xing Chen , Zhi-Hui Jiang
- Applicant: Jin-Xing Chen , Zhi-Hui Jiang
- Applicant Address: CN TW
- Assignee: Hong Fu Jin Precision Industry Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN TW
- Agency: Morris Manning & Martin LLP
- Priority: CN200420071677 20040712
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A motherboard (100) in accordance with a preferred embodiment includes an audio connection area (10) defining a first jack layout (12). The first jack layout integrates second and third jack layouts for two audio connectors of different specifications, so that jacks (121, 122) of the first jack layout can selectively connect with the audio connectors.
Public/Granted literature
- US20060009060A1 Motherboard having selective audio connection jack layout Public/Granted day:2006-01-12
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