发明授权
- 专利标题： Module component
- 专利标题（中）： 模块组件
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申请号： US10485540申请日： 2003-06-16
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公开(公告)号： US07161252B2公开(公告)日： 2007-01-09
- 发明人: Michiaki Tsuneoka , Koji Hashimoto , Masaaki Hayama , Takeo Yasuho
- 申请人： Michiaki Tsuneoka , Koji Hashimoto , Masaaki Hayama , Takeo Yasuho
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2002-210750 20020719
- 国际申请： PCT/JP03/07598 WO 20030616
- 国际公布： WO2004/010499 WO 20040129
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.
公开/授权文献
- US20040232452A1 Module component 公开/授权日：2004-11-25
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