发明授权
- 专利标题: Wireless suspension design with ground plane structure
- 专利标题(中): 无线悬挂设计,具有接地平面结构
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申请号: US10195471申请日: 2002-07-16
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公开(公告)号: US07161767B2公开(公告)日: 2007-01-09
- 发明人: Manuel A. Hernandez , Yen Fu
- 申请人: Manuel A. Hernandez , Yen Fu
- 申请人地址: HK Hong Kong
- 专利权人: SAE Magnetics (H.K.) Ltd.
- 当前专利权人: SAE Magnetics (H.K.) Ltd.
- 当前专利权人地址: HK Hong Kong
- 代理机构: Kenyon & Kenyon LLP
- 主分类号: G11B5/48
- IPC分类号: G11B5/48 ; G11B21/21
摘要:
Methods and devices are described that provide improved electromagnetic interference (EMI) protection for suspension assemblies. In one embodiment, a ground line is provided among the traces that are used in the suspension. Alternatively, a top ground plane is provided on top of the conductive traces with an interposed insulative layer. The ground line and/or the top ground plane provide EMI protection for read and write signals traveling through the traces (e.g., read and write traces) of the suspension assembly. The ground line and/or the top ground plane reduce the interaction between the read and the write traces, thus minimizing cross talk.
公开/授权文献
- US20040012889A1 Wireless suspension design with ground plane structure 公开/授权日:2004-01-22