发明授权
- 专利标题: Real time monitoring of CMP pad conditioning process
- 专利标题(中): 实时监测CMP垫调理过程
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申请号: US11047117申请日: 2005-01-31
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公开(公告)号: US07163435B2公开(公告)日: 2007-01-16
- 发明人: Khoon Peng Lim , Kok Eng Lee
- 申请人: Khoon Peng Lim , Kok Eng Lee
- 申请人地址: SG Singapore
- 专利权人: Tech Semiconductor Singapore Pte. Ltd.
- 当前专利权人: Tech Semiconductor Singapore Pte. Ltd.
- 当前专利权人地址: SG Singapore
- 代理机构: Saile Ackerman LLC
- 代理商 Stephen B. Ackerman
- 主分类号: B24B1/00
- IPC分类号: B24B1/00 ; B24B49/00
摘要:
CMP pad conditioning processes have been monitored and controlled by detecting the vibrational spectrum of a sensor mounted on the conditioner support arm. An accelerometer is used as the detector so that vibrational velocity (which correlates with pad wear) can be measured, rather than displacement or acceleration. After the vibrational spectrum has been transformed to its frequency domain equivalent, it is monitored for the presence of abnormal peaks in order to control the conditioning process.
公开/授权文献
- US20060172662A1 REAL TIME MONITORING OF CMP PAD CONDITIONING PROCESS 公开/授权日:2006-08-03
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