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US07163885B2 Method of migrating and fixing particles in a solution to bumps on a chip 有权
将溶液中的颗粒迁移并固定在芯片上的凸块上的方法

Method of migrating and fixing particles in a solution to bumps on a chip
摘要：
A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor with a solution along with the conductive particles. The conductive particles are then migrated and fixed to the bonding locations on the bumps of a chip through an electrophoresis procedure. For conductive particles not carrying charges, they can sink naturally to the surface of chip bumps due to their higher density than water in the solution. An electroplating procedure is then applied to fix the conductive particles onto the bump.
摘要（中）：

提供了使用电泳技术将颗粒分散并固定在芯片的凸块上的方法。 通过在金属和硫醇之间进行电荷的化学键合来处理颗粒和芯片凸块以携带电荷。 将芯片与导电颗粒一起放置在具有溶液的反应器中。 然后通过电泳方法将导电颗粒迁移并固定到芯片的凸块上的结合位置。 对于不携带电荷的导电颗粒，由于它们比溶液中的密度高，它们可以自然地沉积到芯片凸块的表面。 然后施加电镀程序以将导电颗粒固定到凸块上。

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