发明授权
- 专利标题： Quad flat flip chip package and leadframe thereof
- 专利标题（中）： 四平面倒装芯片封装及其引线框架
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申请号： US10904517申请日： 2004-11-15
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公开(公告)号： US07164202B2公开(公告)日： 2007-01-16
- 发明人: Hsueh-Te Wang , Meng-Jen Wang , Chien Liu , Chi-Hao Chiu
- 申请人： Hsueh-Te Wang , Meng-Jen Wang , Chien Liu , Chi-Hao Chiu
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Jianq Chyun IP Office
- 优先权： TW93100023A 20040102
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A quad flat flip chip package and a leadframe therefor are provided. A bump connection part is defined by bending or etching the leads of the leadframe. Thus, the bump formed after a reflow process is limited within the bump connection part, and the collapse of the bump can be prevented. Moreover, and the manufacturing costs of the package can be decreased and the process thereof can be simplified.
公开/授权文献
- US20050156296A1 QUAD FLAT FLIP CHIP PACKAGE AND LEADFRAME THEREOF 公开/授权日：2005-07-21
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