发明授权
- 专利标题： Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
- 专利标题（中）： 半导体集成电路的制造方法，半导体集成电路和半导体集成电路装置
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申请号： US10996857申请日： 2004-11-23
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公开(公告)号： US07166916B2公开(公告)日： 2007-01-23
- 发明人: Tetsuya Akamatsu , Masanori Inamori
- 申请人： Tetsuya Akamatsu , Masanori Inamori
- 申请人地址： JP Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Angell Palmer & Dodge LLP
- 代理商 David C. Conlin; David A. Tucker
- 优先权： JP2004-105944 20040331
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor integrated circuit is so structured that a first insulating layer is formed on a surface of a semiconductor chip and a second insulating layer covers an entire region of the surface of the semiconductor chip. Via apertures made to the second insulating layer, an electrical connection configuration is formed from above the second insulating layer by using gold wires. Then, an electronic component is mounted on the second insulating layer. By arranging as such, the electronic component is mounted on the semiconductor chip in advance. Therefore, it is possible to further reduce mounting space on a printed-wiring board and also possible to make is easy to attain one-packaged IC.
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