A technique is provided for coupling and uncoupling modular devices with electronic and computing devices. A latch is coupled to a release member, which operates to release the latch from a mate latch by bending the release member to move the latch laterally away from the mate latch. The release member also may have grips for tool-lessly bending the release member to release the latch from the mate latch, and for removing the desired device. The technique also may embody a modular device having the latch and release member, or it may embody an overall system having the modular device disposed in a receptacle.