Invention Grant
- Patent Title: Fastening structure for use at low temperature
- Patent Title (中): 在低温下使用的紧固结构
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Application No.: US10845069Application Date: 2004-05-14
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Publication No.: US07168744B2Publication Date: 2007-01-30
- Inventor: Yuuichi Ashibe , Takato Masuda , Yoshihisa Takahashi , Shoichi Honjo , Masato Shimodate , Keisuke Etoh
- Applicant: Yuuichi Ashibe , Takato Masuda , Yoshihisa Takahashi , Shoichi Honjo , Masato Shimodate , Keisuke Etoh
- Applicant Address: JP Osaka JP Tokyo
- Assignee: Sumitomo Electric Industries,Tokyo Electric Power Company
- Current Assignee: Sumitomo Electric Industries,Tokyo Electric Power Company
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Foley & Lardner
- Priority: JP2003-174394 20030619
- Main IPC: F17C1/00
- IPC: F17C1/00 ; F16B4/00 ; F16L41/00

Abstract:
A first flange and a second flange are superposed and fastened with a bolt and a nut in a fastening operation, to implement a fastening structure used at temperature lower than atmospheric temperature for the fastening operation. Assuming that the first flange has a thickness L1 and a coefficient of linear expansion α1, the second flange has a thickness L2 and a coefficient of linear expansion α2, superposed first flange and second flange have a thickness L, and the bolt has a coefficient of linear expansion α, a relation of L·α≧L1·α1+L2·α2 is satisfied, i.e. heat shrinkage of the bolt is not smaller than the total heat shrinkage of the first and second flanges. Thus, impairment of sealing property due to heat shrinkage is avoided at a flange junction used at low temperature.
Public/Granted literature
- US20040256855A1 Fastening structure for use at low temperature Public/Granted day:2004-12-23
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