发明授权
US07169235B2 Cleaning method and polishing apparatus employing such cleaning method
有权
使用这种清洁方法的清洁方法和抛光装置
- 专利标题： Cleaning method and polishing apparatus employing such cleaning method
- 专利标题（中）： 使用这种清洁方法的清洁方法和抛光装置
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申请号： US10844317申请日： 2004-05-13
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公开(公告)号： US07169235B2公开(公告)日： 2007-01-30
- 发明人: Yutaka Wada , Hirokuni Hiyama , Norio Kimura
- 申请人： Yutaka Wada , Hirokuni Hiyama , Norio Kimura
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP10-246799 19980901
- 主分类号： C23G1/02
- IPC分类号： C23G1/02
摘要：
A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.