发明授权
- 专利标题： Laminated radiation member, power semiconductor apparatus, and method for producing the same
- 专利标题（中）： 层叠辐射构件，功率半导体装置及其制造方法
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申请号： US11179216申请日： 2005-07-12
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公开(公告)号： US07170186B2公开(公告)日： 2007-01-30
- 发明人: Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
- 申请人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
- 申请人地址： JP Nagoya
- 专利权人： NGK Insulators, Ltd.
- 当前专利权人： NGK Insulators, Ltd.
- 当前专利权人地址： JP Nagoya
- 代理机构： Burr & Brown
- 优先权： JP2000-023422 20000131
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.