发明授权
- 专利标题： Low stress conductive polymer bump
- 专利标题（中）： 低应力导电聚合物凸块
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申请号： US10711185申请日： 2004-08-31
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公开(公告)号： US07170187B2公开(公告)日： 2007-01-30
- 发明人: William E. Bernier , Marie S. Cole , Mukta G. Farooq , John U. Knickerbocker , Tasha E. Lopez , Roger A. Quon , David J. Welsh
- 申请人： William E. Bernier , Marie S. Cole , Mukta G. Farooq , John U. Knickerbocker , Tasha E. Lopez , Roger A. Quon , David J. Welsh
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Gibb I.P. Law Firm, LLC
- 代理商 James C. Cioffi, Esq.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
公开/授权文献
- US20060043608A1 LOW STRESS CONDUCTIVE POLYMER BUMP 公开/授权日：2006-03-02
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