Invention Grant
US07171738B2 Systems for processing workpieces 有权
加工工件系统

Systems for processing workpieces
Abstract:
Systems, including method and apparatus, for processing workpieces driven automatically along a linear path to a plurality of positions disposed substantially along the linear path. In some embodiments, a workpiece may be processed at one or more of the positions using two or more processing stations, such as a first processing station that cuts the workpiece into segments and a second processing station that performs another processing operation on the workpiece.
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