Invention Grant
- Patent Title: Temperature compensated strain measurement
- Patent Title (中): 温度补偿应变测量
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Application No.: US11023848Application Date: 2004-12-28
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Publication No.: US07171851B2Publication Date: 2007-02-06
- Inventor: Masahiro Kamata
- Applicant: Masahiro Kamata
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent Karan Singh; William Batzer; Dale Gaudier
- Main IPC: E21B47/00
- IPC: E21B47/00
Abstract:
The present invention provides methods and apparatus for measuring subterranean strain. The methods and apparatus use fluid expansion principles to compensate for temperature variations and increase the accuracy of the strain measurements. The methods and apparatus contemplate the use of multiple fluid chambers according to some embodiments in order to remove temperature dependence from stress or strain measurements.
Public/Granted literature
- US20060137442A1 Temperature compensated strain measurement Public/Granted day:2006-06-29
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