发明授权
US07172786B2 Methods for improving positioning performance of electron beam lithography on magnetic wafers 失效
改善电子束光刻在磁晶片上的定位性能的方法

Methods for improving positioning performance of electron beam lithography on magnetic wafers
摘要:
The present invention discloses a method for the production of sub-micron structures on magnetic materials using electron beam lithography. A subtractive process is disclosed wherein a portion of a magnetic material layer is removed from the substrate using conventional lithography, and the remaining portion of the magnetic material layer is patterned by e-beam lithography. A additive process is also disclosed wherein a thin magnetic seed layer is deposited on the substrate, a portion of which is removed by conventional lithography and replaced with a non-magnetic conducting layer. The remaining portion of magnetic seed layer is patterned by e-beam lithography and the final magnetic structure produced by electroplating.
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