Invention Grant
- Patent Title: PC card assembly with frame having longitudinal slot
- Patent Title (中): 具有纵向槽的框架的PC卡组件
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Application No.: US10796311Application Date: 2004-03-08
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Publication No.: US07173826B1Publication Date: 2007-02-06
- Inventor: Ren-Kang Chiou , Edward W. Lee , Kuang-Yu Wang
- Applicant: Ren-Kang Chiou , Edward W. Lee , Kuang-Yu Wang
- Applicant Address: US CA San Jose
- Assignee: Super Talent Electronics, Inc.
- Current Assignee: Super Talent Electronics, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Bever, Hoffman & Harms, LLP
- Agent Patrick T. Bever
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A PC card frame kit for housing a printed circuit board assembly (PCBA) including a board (PCB) and a connector mounted on a back edge of the PCB. The frame kit includes a frame including first and second parallel side rails and an end rail extending between first ends of the first and second side rails. The frame defines an open end and a longitudinal slot for slidably receiving the PCB. Side panels of the PC card frame kit are then snap-coupled onto the frame.
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