发明授权
US07176110B2 Technique for forming transistors having raised drain and source regions with different heights
有权
用于形成具有不同高度的升高的漏极和源极区域的晶体管的技术
- 专利标题: Technique for forming transistors having raised drain and source regions with different heights
- 专利标题(中): 用于形成具有不同高度的升高的漏极和源极区域的晶体管的技术
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申请号: US10862518申请日: 2004-06-07
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公开(公告)号: US07176110B2公开(公告)日: 2007-02-13
- 发明人: Ralf van Bentum , Scott Luning , Thorsten Kammler
- 申请人: Ralf van Bentum , Scott Luning , Thorsten Kammler
- 申请人地址: US TX Austin
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: US TX Austin
- 代理机构: Williams, Morgan & Amerson, P.C.
- 优先权: DE10351008 20031031
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/36
摘要:
The height of epitaxially grown semiconductor regions in extremely scaled semiconductor devices may be adjusted individually for different device regions in that two or more epitaxial growth steps may be carried out, wherein an epitaxial growth mask selectively suppresses the formation of a semiconductor region in a specified device region. In other embodiments, a common epitaxial growth process may be used for two or more different device regions and subsequently a selective oxidation process may be performed on selected device regions so as to precisely reduce the height of the previously epitaxially grown semiconductor regions in the selected areas.
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