Invention Grant
- Patent Title: Method for charging substrate to a potential
- Patent Title (中): 将基板充电到电位的方法
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Application No.: US10942184Application Date: 2004-09-16
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Publication No.: US07176468B2Publication Date: 2007-02-13
- Inventor: Kirk J. Bertsche , Mark A. McCord
- Applicant: Kirk J. Bertsche , Mark A. McCord
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corporation
- Current Assignee: KLA-Tencor Technologies Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01J37/244
- IPC: H01J37/244

Abstract:
A surface of an insulating substrate is charged to a target potential. In one embodiment, the surface is flooded with a higher-energy electron beam such that the electron yield is greater than one. Subsequently, the surface is flooded with a lower-energy electron beam such that the electron yield is less than one. In another embodiment, the substrate is provided with the surface in a state at an approximate initial potential above the target potential. The surface is then flooded with charged particle such that the charge yield of scattered particles is less than one, such that a steady state is reached at which the target potential is achieved. Another embodiment pertains to an apparatus for charging a surface of an insulating is substrate to a target potential.
Public/Granted literature
- US20060054815A1 Method for charging substrate to a potential Public/Granted day:2006-03-16
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