发明授权
US07176503B2 Light emitting diode package and light source comprising the same
失效
发光二极管封装和包含该发光二极管封装的光源
- 专利标题： Light emitting diode package and light source comprising the same
- 专利标题（中）： 发光二极管封装和包含该发光二极管封装的光源
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申请号： US10967212申请日： 2004-10-19
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公开(公告)号： US07176503B2公开(公告)日： 2007-02-13
- 发明人: Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
- 申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
- 申请人地址： KR Kyungki-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Kyungki-Do
- 代理机构： Lowe, Hauptman & Berner, LLP.
- 优先权： KR10-2004-0051428 20040702
- 主分类号： H01L29/24
- IPC分类号： H01L29/24 ; H01L31/12
摘要：
An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.