发明授权
- 专利标题： Electronically grounded heat spreader
- 专利标题（中）： 电子接地散热器
-
申请号： US10665997申请日： 2003-09-18
-
公开(公告)号： US07176563B2公开(公告)日： 2007-02-13
- 发明人: Eric Duchesne , Michael A. Gaynes
- 申请人： Eric Duchesne , Michael A. Gaynes
- 申请人地址： US NY Armonk
- 专利权人： International Business Machine Corporation
- 当前专利权人： International Business Machine Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 William E. Steinberg, Esq.
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.
公开/授权文献
- US20050062154A1 Electronically grounded heat spreader 公开/授权日：2005-03-24
信息查询
IPC分类:
