Invention Grant
US07180753B2 Server packaging architecture utilizing a blind docking processor-to-midplane mechanism
有权
使用盲对接处理器到中平面机制的服务器包装架构
- Patent Title: Server packaging architecture utilizing a blind docking processor-to-midplane mechanism
- Patent Title (中): 使用盲对接处理器到中平面机制的服务器包装架构
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Application No.: US10606454Application Date: 2003-06-26
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Publication No.: US07180753B2Publication Date: 2007-02-20
- Inventor: Brian M. Kerrigan , Karl K. Dittus , Matthew S. Henry , Michael S. Miller
- Applicant: Brian M. Kerrigan , Karl K. Dittus , Matthew S. Henry , Michael S. Miller
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Sawyer Law Group LLP
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/18

Abstract:
A dual motion docking apparatus for docking an electronics console to a component board in a chassis is disclosed. The electronics console and the component board lie in the same plane of the chassis, but the electronics console must be mated with the component board at an angle orthogonal to a direction of installation of the electronics console. Aspects of the present invention include a first docking mechanism for slidably inserting the electronics console into a chassis, such that connectors on the electronics console align with connectors on the component board. The first docking mechanism preferably comprises a docking base coupled to the electronics console that has a longitudinal female portion, and a longitudinal male portion located on an underside of the electronics console, wherein when the electronics console is inserted into an opening in a chassis, the male portion engages the female portion of the docking base to guide the electronics console along the docking base as the electronics console is slid into the chassis. The dual motion docking apparatus further includes a second docking mechanism for laterally moving the electronics console towards the component board, such that the electronics console connectors engage the component board connectors, thereby enabling the blind docking between the electronics console and the component board. The second docking mechanism preferably comprises a handle extending from a front of the electronics console, and a cam mechanism having a portion that is held immobile by a docking base, wherein after the electronics console is slid into the chassis, the handle is pushed rearward by hand to actuate the cam mechanism, which then pulls the electronics console towards the component board.
Public/Granted literature
- US20040264123A1 Server packaging architecture utilizing a blind docking processor-to-midplane mechanism Public/Granted day:2004-12-30
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