- 专利标题: Heating and cooling apparatus, and vacuum processing apparatus equipped with this apparatus
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申请号: US09906130申请日: 2001-07-17
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公开(公告)号: US07182122B2公开(公告)日: 2007-02-27
- 发明人: Toshiaki Koguchi , Kazuhito Watanabe , Nobuyuki Takahashi
- 申请人: Toshiaki Koguchi , Kazuhito Watanabe , Nobuyuki Takahashi
- 申请人地址: JP Tokyo
- 专利权人: Anelva Corporation
- 当前专利权人: Anelva Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Venable, LLP
- 代理商 James R. Burdett
- 优先权: JP2000-243948 20000811
- 主分类号: F25B29/00
- IPC分类号: F25B29/00
摘要:
A heating and cooling apparatus with which batch processing is possible and throughput can be increased, and furthermore which is more compact and uses less energy. A substrate heating chamber and a substrate cooling chamber each capable of simultaneously holding a plurality of substrates are provided in a thermally separated state in a heating and cooling apparatus with a single vacuum processing chamber. The substrate heating chamber is equipped with a plurality of communicating or non-communicating substrate holding spaces. The substrate cooling chamber is also equipped with a plurality of communicating or non-communicating substrate holding spaces. The communicating substrate holding spaces allow the batch heat treatment of substrates, while the non-communicating substrate holding spaces allow the batch or individual processing of substrates.