发明授权
- 专利标题： Solder coated lid
- 专利标题（中）： 焊锡盖
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申请号： US10861371申请日： 2004-06-07
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公开(公告)号： US07182240B2公开(公告)日： 2007-02-27
- 发明人: Hideyuki Yoshino , Sanae Taniguchi , Mitsuo Zen , Takenori Azuma
- 申请人： Hideyuki Yoshino , Sanae Taniguchi , Mitsuo Zen , Takenori Azuma
- 申请人地址： JP Tokyo
- 专利权人： Senju Metal Industry Co., Ltd.
- 当前专利权人： Senju Metal Industry Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理商 Michael Tobias
- 优先权： JP2000-380985 20001214
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.
公开/授权文献
- US20040258948A1 Solder coated lid 公开/授权日：2004-12-23