Invention Grant
- Patent Title: Composite foamed polypropylene resin molding and method of producing same
- Patent Title (中): 复合发泡聚丙烯树脂成型及其制造方法
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Application No.: US10502934Application Date: 2003-03-19
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Publication No.: US07182896B2Publication Date: 2007-02-27
- Inventor: Akinobu Hira , Keiichi Hashimoto , Hidehiro Sasaki
- Applicant: Akinobu Hira , Keiichi Hashimoto , Hidehiro Sasaki
- Applicant Address: JP Tokyo
- Assignee: JSP Corporation
- Current Assignee: JSP Corporation
- Current Assignee Address: JP Tokyo
- Agency: Bacon & Thomas, PLLC
- Priority: JP2002-077383 20020319
- International Application: PCT/JP03/03318 WO 20030319
- International Announcement: WO03/078127 WO 20030925
- Main IPC: B29C44/04
- IPC: B29C44/04

Abstract:
A composite foamed polypropylene resin molding including a plurality of sections which are fuse-bonded to each other, at least two of which differ from each other in color, apparent density, composition and/or mechanical strengths, each of which is formed from expanded polypropylene resin beads, and each of which shows a high temperature endothermic peak in a DSC curve thereof. At least one of the sections satisfies conditions (d) to (f) at the same time: (d) to be formed from specific expanded polypropylene resin beads of a base resin having a tensile modulus of at least 1,200 MPa, (e) to have an apparent density D2 of 10–500 g/L, and (f) to have such a high temperature endothermic peak with a calorific of E2 J/g, wherein D2 and E2 have the relationship 20−0.020×D2≦E2≦65−0.100×D2. The composite molding may be prepared by filling expanded polypropylene resin beads in each of a plurality of contiguous spaces defined in a mold cavity and heating the expanded beads to fuse-bond respective expanded beads together into a unitary body. At least one of the spaces is filled with the specific expanded polypropylene resin beads.
Public/Granted literature
- US20050056957A1 Composite foamed polypropylene resin molding and method of producing same Public/Granted day:2005-03-17
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