发明授权
US07183223B1 Methods for forming small contacts 有权
形成小触点的方法

Methods for forming small contacts
摘要:
Methods are provided for forming contacts for a semiconductor device. The methods may include depositing various materials, such as polysilicon, nitride, oxide, and/or carbon materials, over the semiconductor device. The methods may also include forming a contact hole and filling the contact hole to form the contact for the semiconductor device.
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