Invention Grant
- Patent Title: Modular raised wall paneling system
- Patent Title (中): 模块化墙壁镶嵌系统
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Application No.: US10389497Application Date: 2003-03-14
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Publication No.: US07185469B2Publication Date: 2007-03-06
- Inventor: Gary Schaffeld
- Applicant: Gary Schaffeld
- Applicant Address: US OH Cincinnati
- Assignee: Advantage Architectural Products, Ltd.
- Current Assignee: Advantage Architectural Products, Ltd.
- Current Assignee Address: US OH Cincinnati
- Agency: Smith Brandenburg Ltd.
- Agent Mark F. Smith
- Main IPC: E04B2/00
- IPC: E04B2/00

Abstract:
The present invention is a new and novel modular raised wall paneling system and method of manufacture that is economical, labor non-intensive, and can be easily constructed for a variety of room configurations and dimensions. The modular raised wall paneling system of the present invention comprises a plurality of individual panel sections having a joint there between, wherein a panel section includes a recess portion forming the appearance of a raised panel thereon. In a preferred embodiment of the invention the panel sections include along opposed longitudinal edges a tongue and a groove such that the panel sections can be disposed in parallel side-by-side mating relationship such that the tongue of one panel section is received in the groove of an adjacent panel section.
Public/Granted literature
- US20040177583A1 Modular raised wall paneling system and method of manufacture Public/Granted day:2004-09-16
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