发明授权
- 专利标题： Composition and method for temporarily fixing solid
- 专利标题（中）： 用于临时固定固体的组合物和方法
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申请号： US10483178申请日： 2003-05-12
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公开(公告)号： US07186448B2公开(公告)日： 2007-03-06
- 发明人: Yasuaki Yokoyama , Nobuo Bessho , Masaaki Hanamura
- 申请人： Yasuaki Yokoyama , Nobuo Bessho , Masaaki Hanamura
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2002-136995 20020513; JP2002-157059 20020530; JP2002-157060 20020530; JP2002-235607 20020813; JP2002-282307 20020927; JP2003-059542 20030306; JP2003-061792 20030307; JP2003-061793 20030307
- 国际申请： PCT/JP03/05899 WO 20030512
- 国际公布： WO03/095579 WO 20031120
- 主分类号： C09K19/02
- IPC分类号： C09K19/02 ; C09J11/00 ; C09J5/04 ; C09J5/06 ; H01L21/68
摘要：
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.
公开/授权文献
- US20040185187A1 Composition and method for temporarily fixing solid 公开/授权日：2004-09-23
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