Invention Grant
- Patent Title: Stacked package module
- Patent Title (中): 堆叠封装模块
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Application No.: US10934409Application Date: 2004-09-07
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Publication No.: US07187070B2Publication Date: 2007-03-06
- Inventor: Chi Chih Chu , Cheng-Yin Lee , Gwo-Liang Weng , Shih-Chang Lee
- Applicant: Chi Chih Chu , Cheng-Yin Lee , Gwo-Liang Weng , Shih-Chang Lee
- Applicant Address: TW Kaoshiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaoshiung
- Agency: Bacon & Thomas, PLLC
- Priority: TW92124790A 20030908
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.
Public/Granted literature
- US20050082656A1 Stacked package module Public/Granted day:2005-04-21
Information query
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