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发明授权
US07187077B1 Integrated circuit having a lid and method of employing a lid on an integrated circuit 有权
具有盖的集成电路和在集成电路上采用盖的方法

  • 专利标题： Integrated circuit having a lid and method of employing a lid on an integrated circuit
  • 专利标题（中）： 具有盖的集成电路和在集成电路上采用盖的方法
  • 申请号： US10805112
    申请日： 2004-03-19
  • 公开(公告)号： US07187077B1
    公开(公告)日： 2007-03-06
  • 发明人: Kumar Nagarajan
  • 申请人： Kumar Nagarajan
  • 申请人地址： US CA San Jose
  • 专利权人： Xilinx, Inc.
  • 当前专利权人： Xilinx, Inc.
  • 当前专利权人地址： US CA San Jose
  • 代理商 John J. King
  • 主分类号： H01L23/04
  • IPC分类号： H01L23/04
Integrated circuit having a lid and method of employing a lid on an integrated circuit
摘要：
The present invention relates to a lid for an integrated circuit. According to one embodiment, an integrated circuit having a lid comprises a substrate having a flat surface and extending a first length and a lid having a recess and a foot portion. The lid generally has a second length shorter than the first length, and is positioned on the flat surface of the substrate. Finally, a bonding agent is positioned on the flat surface adjacent the foot portion of the lid. According to an alternate embodiment, a second component is positioned on the substrate outside the foot portion, and an adhesive seal is positioned on the substrate adjacent the foot and covering the component. A method of securing a lid to an integrated circuit is also disclosed.
摘要（中）：

本发明涉及一种用于集成电路的盖子。 根据一个实施例，具有盖的集成电路包括具有平坦表面并且延伸第一长度的基板和具有凹部和底脚部分的盖。 盖通常具有比第一长度短的第二长度，并且位于基板的平坦表面上。 最后，接合剂位于邻近盖的脚部的平坦表面上。 根据替代实施例，第二部件位于基部外部的基部上，并且粘合密封件位于邻近脚部并覆盖部件的基底上。 还公开了将盖固定到集成电路的方法。

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