Invention Grant
- Patent Title: Semiconductor device for sensor system
- Patent Title (中): 传感器系统半导体器件
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Application No.: US10457498Application Date: 2003-06-10
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Publication No.: US07187961B2Publication Date: 2007-03-06
- Inventor: Shunzo Yamashita , Kei Suzuki , Toshiyuki Aritsuka , Masayuki Miyazaki , Sadaki Nakano
- Applicant: Shunzo Yamashita , Kei Suzuki , Toshiyuki Aritsuka , Masayuki Miyazaki , Sadaki Nakano
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout and Kraus, LLP.
- Priority: JPP2002-185450 20020626
- Main IPC: A61B5/00
- IPC: A61B5/00
Abstract:
A semiconductor device is employable for a compact and light-weight sensor system that is free of the need for battery replacement. The semiconductor device has a sensor chip (SCHIP1) comprising sensors (TD1, AS1, PD1, GS1), an A/D conversion circuit (AD1), a microprocessor (CPU1), a memory (MEM1), a transmission circuit (RF1), and a power generation circuit (CM1). The sensors, the A/D conversion circuit, the microprocessor, the memory, and the transmission circuit are formed on one side (SIDE1) of a substrate, while the power generation unit is formed on the other side (SIDE2) of the substrate.
Public/Granted literature
- US20040000713A1 Semiconductor device for sensor system Public/Granted day:2004-01-01
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