发明授权
- 专利标题： Fingerprint sensor apparatus and manufacturing method thereof
- 专利标题（中）： 指纹传感器装置及其制造方法
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申请号： US10289268申请日： 2002-11-07
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公开(公告)号： US07192798B2公开(公告)日： 2007-03-20
- 发明人: Akira Okada , Hideharu Sakoda , Michio Hayakawa , Fumihiko Taniguchi
- 申请人： Akira Okada , Hideharu Sakoda , Michio Hayakawa , Fumihiko Taniguchi
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP.
- 优先权： JP2002-043708 20020220
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A fingerprint sensor apparatus can provide a normal fingerprint sensor function even when a mold flash is formed. The fingerprint sensor apparatus recognizes a pattern of a fingerprint by being contacted by a finger. A semiconductor chip has a surface on which a sensor part is formed. The semiconductor chip is encapsulated by a seal resin. The sensor part is exposed in a bottom of an opening formed in the seal resin part. A distance between an edge of the bottom of the opening and an edge of the sensor part is 0.3 mm to 0.1 mm.
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