- 专利标题： Semiconductor device having a heat spreader exposed from a seal resin
-
申请号： US10352074申请日： 2003-01-28
-
公开(公告)号： US07193320B2公开(公告)日： 2007-03-20
- 发明人: Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
- 申请人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP.
- 优先权： JP2002-158277 20020530
- 主分类号： H01L23/06
- IPC分类号： H01L23/06
摘要：
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
公开/授权文献
信息查询
IPC分类:
