Invention Grant
- Patent Title: Polymer and epoxy resin compositions
- Patent Title (中): 聚合物和环氧树脂组合物
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Application No.: US11516590Application Date: 2006-09-07
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Publication No.: US07196141B2Publication Date: 2007-03-27
- Inventor: Kenichi Kitano , Yoshiki Nakagawa , Masayuki Fujita
- Applicant: Kenichi Kitano , Yoshiki Nakagawa , Masayuki Fujita
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Agency: Connolly, Bove, Lodge & Hutz, LLP
- Priority: JP10/234430 19980820; JP10/234431 19980820; JP10/260195 19980914
- Main IPC: C08F8/08
- IPC: C08F8/08 ; C08F120/18 ; C08F120/24 ; C08F120/28 ; C08F120/32
Abstract:
The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living-radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition-having an epoxy group at a main chain terminus thereof.
Public/Granted literature
- US20070004874A1 Polymer and epoxy resin compositions Public/Granted day:2007-01-04
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