Invention Grant
- Patent Title: Termination design with multiple spiral trench rings
- Patent Title (中): 带多个螺旋槽环的端接设计
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Application No.: US11073123Application Date: 2005-03-04
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Publication No.: US07196397B2Publication Date: 2007-03-27
- Inventor: Davide Chiola , He Zhi , Kohji Andoh , Daniel M. Kinzer
- Applicant: Davide Chiola , He Zhi , Kohji Andoh , Daniel M. Kinzer
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Ostrolenk, Faber, Gerb & Soffen, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/04 ; H01L21/02
Abstract:
A semiconductor device having a termination structure, which includes at least one spiral resistor disposed within a spiral trench and connected between two power poles of the device.
Public/Granted literature
- US20050230777A1 Termination design with multiple spiral trench rings Public/Granted day:2005-10-20
Information query
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