发明授权
US07198549B2 Continuous contour polishing of a multi-material surface 有权
多材料表面的连续轮廓抛光

Continuous contour polishing of a multi-material surface
摘要:
A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.
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