Invention Grant
- Patent Title: Camera module fabrication method including singulating a substrate
- Patent Title (中): 相机模块制造方法,包括单片基片
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Application No.: US11526168Application Date: 2006-09-21
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Publication No.: US07199359B2Publication Date: 2007-04-03
- Inventor: Steven Webster
- Applicant: Steven Webster
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Gunnison, McKay & Hodgson, L.L.P.
- Agent Serge J. Hodgson
- Main IPC: H01J5/02
- IPC: H01J5/02

Abstract:
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
Public/Granted literature
- US20070012864A1 CAMERA MODULE FABRICATION METHOD Public/Granted day:2007-01-18
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