Invention Grant
US07199359B2 Camera module fabrication method including singulating a substrate 有权
相机模块制造方法,包括单片基片

Camera module fabrication method including singulating a substrate
Abstract:
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
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