发明授权
- 专利标题： Semiconductor package
- 专利标题（中）： 半导体封装
-
申请号： US10934453申请日： 2004-09-07
-
公开(公告)号： US07199400B2公开(公告)日： 2007-04-03
- 发明人: Masatoshi Sasuga
- 申请人： Masatoshi Sasuga
- 申请人地址： JP Yamanashi
- 专利权人： Citizen Electronics Co., Ltd.
- 当前专利权人： Citizen Electronics Co., Ltd.
- 当前专利权人地址： JP Yamanashi
- 代理机构： Browdy and Neimark, PLLC
- 优先权： JP2003-317570 20030909
- 主分类号： H01L27/15
- IPC分类号： H01L27/15
摘要：
A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.
公开/授权文献
- US20050051792A1 Semiconductor package 公开/授权日：2005-03-10
信息查询
IPC分类:
