Invention Grant
- Patent Title: Component mounting apparatus and method
- Patent Title (中): 组件安装装置及方法
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Application No.: US11222153Application Date: 2005-09-09
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Publication No.: US07200922B2Publication Date: 2007-04-10
- Inventor: Akira Kabeshita , Naoto Mimura , Noriaki Yoshida , Yoshihiko Misawa , Takeyuki Kawase , Tetsutarou Hachimura , Toshiro Nishiwaki , Taira Ishii , Mitsuo Kawate , Hideaki Watanabe
- Applicant: Akira Kabeshita , Naoto Mimura , Noriaki Yoshida , Yoshihiko Misawa , Takeyuki Kawase , Tetsutarou Hachimura , Toshiro Nishiwaki , Taira Ishii , Mitsuo Kawate , Hideaki Watanabe
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2000-251117 20000822; JP2000-375872 20001211; JP2000-376145 20001211
- Main IPC: B23P19/00
- IPC: B23P19/00
Abstract:
A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.
Public/Granted literature
- US20060000085A1 Component mounting apparatus and method Public/Granted day:2006-01-05
Information query
