Invention Grant
- Patent Title: Method and apparatus for rotating a semiconductor substrate
- Patent Title (中): 用于旋转半导体衬底的方法和装置
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Application No.: US10407953Application Date: 2003-04-04
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Publication No.: US07201808B2Publication Date: 2007-04-10
- Inventor: Ho-man Rodney Chiu , Steven Verhaverbeke , John S. Lewis
- Applicant: Ho-man Rodney Chiu , Steven Verhaverbeke , John S. Lewis
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman
- Main IPC: B08B11/02
- IPC: B08B11/02 ; B23B5/00
Abstract:
An apparatus that includes a rotatable single wafer holding bracket with one or more wafer supports disposed on the single wafer holding bracket, wherein the one or more wafer supports position a center of a wafer to be off-center from an axis of rotation of the single wafer holding bracket.
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