Invention Grant
- Patent Title: Electromagnetically shielded circuit device and shielding method therefor
- Patent Title (中): 电磁屏蔽电路装置及其屏蔽方法
-
Application No.: US10511994Application Date: 2003-04-23
-
Publication No.: US07202422B2Publication Date: 2007-04-10
- Inventor: Toshinobu Ogatsu
- Applicant: Toshinobu Ogatsu
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Muirhead & Saturnelli, LLC
- Priority: JP2002-120828 20020423
- International Application: PCT/JP03/05136 WO 20030423
- International Announcement: WO03/092347 WO 20031106
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
In a method of shielding a circuit device, a circuit board on which an electronic component has mounted and which has a ground connection portion is provided. An entire portion of the circuit board is inserted into a shield pack having a sack shape. The shield pack has an insulating layer as an innermost layer and an electric conductive layer as an outermost layer. The insulating layer of the shield pack is contacted with the electronic component and the circuit board. The ground connection portion of the circuit board is connected to the electric conducive layer of the shield pack.
Public/Granted literature
- US20050162841A1 Electromagnetically shielded circuit device and shielding method therefor Public/Granted day:2005-07-28
Information query
