发明授权
US07204683B2 Molding die for covering optical fiber and optical fiber cover forming device
有权
用于覆盖光纤和光纤覆盖成型装置的成型模具
- 专利标题： Molding die for covering optical fiber and optical fiber cover forming device
- 专利标题（中）： 用于覆盖光纤和光纤覆盖成型装置的成型模具
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申请号： US10468674申请日： 2002-06-20
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公开(公告)号： US07204683B2公开(公告)日： 2007-04-17
- 发明人: Toshio Shibata , Tomohiro Akiyama , Hideki Watanabe , Hidekazu Kojima
- 申请人： Toshio Shibata , Tomohiro Akiyama , Hideki Watanabe , Hidekazu Kojima
- 申请人地址： JP Tokyo
- 专利权人： The Furukawa Electric Co., Ltd.
- 当前专利权人： The Furukawa Electric Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2001-189554 20010622; JP2001-326644 20011024
- 国际申请： PCT/JP02/06153 WO 20020620
- 国际公布： WO03/001259 WO 20030103
- 主分类号： B29C45/14
- IPC分类号： B29C45/14 ; B29C70/74
摘要：
A mold is provided in which a molding portion, formed between joint surfaces of upper and lower molds superimposed one upon the other, is filled with UV curable resin after arranging a coating formation portion of an optical fiber in the molding portion, the coating formation portion is coated with the UV curable resin when the resin is cured by irradiating light thereto from outside, and a shading plate is arranged in the periphery of the molding portion. In a case equipped with the mold, there is provided a mirror or a lens for reflecting UV light to UV curable resin.
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