发明授权
- 专利标题： Flexible substrate having interlaminar junctions, and process for producing the same
- 专利标题（中）： 具有层间结合的柔性基板及其制造方法
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申请号： US11079371申请日： 2005-03-15
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公开(公告)号： US07205483B2公开(公告)日： 2007-04-17
- 发明人: Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
- 申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JPP2004-079848 20040319; JPP2004-088853 20040325; JPP2004-088854 20040325; JPP2004-318887 20041102; JPP2004-318888 20041102
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.