Invention Grant
- Patent Title: Over-current protection device and manufacturing method thereof
- Patent Title (中): 过流保护装置及其制造方法
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Application No.: US10978856Application Date: 2004-11-01
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Publication No.: US07205878B2Publication Date: 2007-04-17
- Inventor: Zack Lin , Ching Han Yu
- Applicant: Zack Lin , Ching Han Yu
- Applicant Address: TW Hsinchu
- Assignee: Polytronics Technology Corporation
- Current Assignee: Polytronics Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Seyfarth Shaw LLP
- Priority: TW92130914A 20031105
- Main IPC: H01H85/11
- IPC: H01H85/11 ; H01C7/13

Abstract:
An over-current protection device comprises at least one PTC component, at least one thermal dissipation layer, at least one adhesive layer and at least two isolation layers, wherein the PTC component is formed by interposing a PTC material between two electrode layers. The at least one adhesive layer as a thermal conductive medium is interposed between the PTC component and at least one thermal dissipation layer to combine them. The at least two isolation layers separate the thermal dissipation layer, adhesive layer and electrode layers into two electrical independent portions.
Public/Granted literature
- US20050094347A1 Over-current protection device and manufacturing method thereof Public/Granted day:2005-05-05
Information query
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