Invention Grant
- Patent Title: Methods of bridging lateral nanowires and device using same
- Patent Title (中): 桥接横向纳米线的方法及其使用方法
-
Application No.: US10738176Application Date: 2003-12-17
-
Publication No.: US07208094B2Publication Date: 2007-04-24
- Inventor: M. Saif Islam , Theodore I. Kamins , Shashank Sharma
- Applicant: M. Saif Islam , Theodore I. Kamins , Shashank Sharma
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/00

Abstract:
A semiconductor nanowire is grown laterally. A method of growing the nanowire forms a vertical surface on a substrate, and activates the vertical surface with a nanoparticle catalyst. A method of laterally bridging the nanowire grows the nanowire from the activated vertical surface to connect to an opposite vertical surface on the substrate. A method of connecting electrodes of a semiconductor device grows the nanowire from an activated device electrode to an opposing device electrode. A method of bridging semiconductor nanowires grows nanowires between an electrode pair in opposing lateral directions. A method of self-assembling the nanowire bridges the nanowire between an activated electrode pair. A method of controlling nanowire growth forms a surface irregularity in the vertical surface. An electronic device includes a laterally grown nano-scale interconnection.
Public/Granted literature
- US20050133476A1 Methods of bridging lateral nanowires and device using same Public/Granted day:2005-06-23
Information query