发明授权
- 专利标题: Method of forming semiconductor integrated device
- 专利标题(中): 形成半导体集成器件的方法
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申请号: US11134386申请日: 2005-05-23
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公开(公告)号: US07208359B2公开(公告)日: 2007-04-24
- 发明人: Naohiro Ueda , Yoshinori Ueda
- 申请人: Naohiro Ueda , Yoshinori Ueda
- 申请人地址: JP Tokyo
- 专利权人: Ricoh Company, Ltd.
- 当前专利权人: Ricoh Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Dickstein Shapiro LLP
- 优先权: JP2002-127407 20020426
- 主分类号: H01L21/8234
- IPC分类号: H01L21/8234
摘要:
A semiconductor device is provided comprising several device components formed in the same substrate, such as a P-substrate having an offset Nch transistor including N-type source and drain each formed in a P-well spatially separated from one another, and the drain surrounded by a low concentration N-type diffusion layer; an offset Pch transistor including P-type source and drain each formed in an N-well spatially separated from one another, and the drain surrounded by a low concentration P-type diffusion layer; a triple well including a deep N-well, and a P-type IP well formed therein; a normal N-well for forming a Pch MOS transistor; and a normal P-well for forming an Nch MOS transistor; in which simultaneously formed are the low concentration N-type diffusion layer, N-well and normal N-well; the P-well and normal P-well; and the low concentration P-type diffusion layer and IP well.
公开/授权文献
- US20050221551A1 Method of forming semiconductor integrated device 公开/授权日:2005-10-06
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