发明授权
- 专利标题： Semiconductor device and method of manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US09821361申请日： 2001-03-29
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公开(公告)号： US07208826B2公开(公告)日： 2007-04-24
- 发明人: Noriaki Sakamoto , Isao Ochiai
- 申请人： Noriaki Sakamoto , Isao Ochiai
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Fish & Richardson P.C.
- 优先权： JPP2000-203395 20000705
- 主分类号： H01L23/24
- IPC分类号： H01L23/24 ; H01L23/22
摘要：
Die pads 50, 51, an external connecting electrode 52 and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporting board is required, a low-profile semiconductor device with improved heat radiation can be provided.
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