发明授权
- 专利标题： Encasing arrangement for a semiconductor component
- 专利标题（中）： 半导体元件的封装结构
-
申请号： US10149892申请日： 2000-12-13
-
公开(公告)号： US07208827B2公开(公告)日： 2007-04-24
- 发明人: Christian Hauser , Simon Muff , Jens Pohl , Friedrich Wanninger
- 申请人： Christian Hauser , Simon Muff , Jens Pohl , Friedrich Wanninger
- 申请人地址： DE München
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE München
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权： DE19960246 19991214
- 国际申请： PCT/DE00/04437 WO 20001213
- 国际公布： WO01/45166 WO 20010621
- 主分类号： H01L23/22
- IPC分类号： H01L23/22 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor component package configuration includes a semiconductor chip mounted to a printed circuit board, and a substrate arranged between the semiconductor chip and the printed circuit board. The substrate is for routing the wiring terminals of the semiconductor chip to the printed circuit board. The substrate is connected to the printed circuit board by solder joints. A filler between the semiconductor chip and the substrate mechanically isolates the semiconductor chip and the solder joints. A metal layer, which is connected to solder joints, is applied to the substrate. At least one molded element of heat-dissipating material is applied to the metal layer and is connected in a heat-conducting manner to the metal layer. This provides the package configuration with an improved capability of conducting the lost power that is dissipated from the installed semiconductor chip, and the desired mechanical properties of the package arrangement are retained.
公开/授权文献
- US20050040517A1 Encasing arrangement for a semicoductor component 公开/授权日：2005-02-24