发明授权
US07211526B2 Laser based splitting method, object to be split, and semiconductor element chip
有权
基于激光的分裂方法，待分裂的物体和半导体元件芯片
- 专利标题： Laser based splitting method, object to be split, and semiconductor element chip
- 专利标题（中）： 基于激光的分裂方法，待分裂的物体和半导体元件芯片
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申请号： US11058163申请日： 2005-02-16
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公开(公告)号： US07211526B2公开(公告)日： 2007-05-01
- 发明人: Junichiro Iri , Genji Inada , Sadayuki Sugama , Masayuki Nishiwaki , Hiroyuki Morimoto
- 申请人： Junichiro Iri , Genji Inada , Sadayuki Sugama , Masayuki Nishiwaki , Hiroyuki Morimoto
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2004-042718 20040219; JP2004-042731 20040219; JP2004-335289 20041119
- 主分类号： H01L21/36
- IPC分类号： H01L21/36
摘要：
A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.
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