发明授权
US07211737B2 Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate
有权
安装基板，安装基板安装方法，以及使用安装基板的灯泡插座
- 专利标题： Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate
- 专利标题（中）： 安装基板，安装基板安装方法，以及使用安装基板的灯泡插座
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申请号： US10110678申请日： 2001-08-17
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公开(公告)号： US07211737B2公开(公告)日： 2007-05-01
- 发明人: Fumihiro Minami , Yukari Yamasaki , Mutsuo Sekiya
- 申请人： Fumihiro Minami , Yukari Yamasaki , Mutsuo Sekiya
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2000-248161 20000818
- 国际申请： PCT/JP01/07098 WO 20010817
- 国际公布： WO02/17693 WO 20020228
- 主分类号： H01R12/04
- IPC分类号： H01R12/04 ; H05K1/16
摘要：
A mounting board has a board, retaining members mounted on the upper surface of the board, and a part retained by the retaining members. The part is mounted such that at least a part thereof is arranged below the lower surface of the board, and that the part is electrically connected to the board through the retaining members. Such an arrangement as described above eliminates the need of connecting the discharge gap element to the board by using lead wires, and of mounting it on the upper surface of the board. This lowers the height of the board and admits an elevated part.
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